We are excited to announce the launch of our latest product, the 8 Pin uASIC AM1U1108!

uASIC products are a designer’s best solution for low-power, easy integration of can’t-fail functions that are often begrudgingly implemented with discrete circuitry or off-the-shelf, inflexible parts. With uASIC users can create a design that looks and feels like a custom ASIC without the development time or cost. The AM1U1108 delivers this capability to customers in a tiny 1.0mm x 1.2mm package containing dozens of building blocks for unique configurability.

Key Features of AM1U1108:

Wide Supply Voltage Range: 1.71V to 5.5V
Extended Operating Temperature Range: -40°C to 85°C
Two Combinatorial 2-bit Look Up Tables (LUTs)
Nine Multifunctional Macrocells
Three 8-bit Timers
Oscillator (25kHz/2MHz)
Data protection feature (CRC, CRV)

To explore all the features of the AM1U1108, please download the datasheet.

The AM1U1108 can be quickly configured using our user-friendly schematic-capture tool, Atlas EDA. This powerful software enables designers to easily program and customize the uASIC, making the entire process seamless and efficient. By harnessing the full potential of Atlas EDA, users can unlock the optimal performance of the AM1U1108 and achieve exceptional results for their projects.

Learn more and download Atlas EDA for free

Contact our team to get your 8 Pin uASIC AM1U1108 today and experience the power of customization firsthand.

Highly layered magnetic material is compatible with semiconductor packaging

AM solves the problem of direct integration of magnetics into integrated circuits “chips” by electroplating highly layered magnetic alloys directly on semiconductor epoxy packaging films for short connection to the semiconductor die using standard IC bumping processes. ![article_2_00cb70d7de.jpg](https://r2.atlasmagnetics.com/assets/article_2_00cb70d7de_6eec37d4f8.jpg) This long-desired concept of using available semiconductor manufacturing processes to remove discrete components, such as inductors and transformers, was previously hindered by cost, frequency response, and incompatible processes. However, this development resolves these barriers while delivering the promised size reductions and performance enhancements by magnetic material deposition at temperatures and pressures compatible with semiconductor packaging. “While layering magnetic materials to create high frequency, high efficiency cores is nothing new, what’s new is how to cost effectively create micron to sub-micron layering. This is accomplished by reducing the process steps per layer from 13 to just 4. This simplified process allows new magnetic materials to be engineered for frequency (60 MHz or greater) and Qs (up to 35) with layering up to 60+ layers,” stated Atlas Magnetics CEO, John McDonald. “When these 0.2 to 0.4 mm cores are used in a finished inductor or transformer, values of up to 1 μH for lower power applications, and for high-power reduced inductance applications current densities of up to 10A/mm2 can be achieved. In fact, the layering can be so fine as to yield materials with unique mechanical and electrical parameters. This opens new avenues of research for novel materials not previously economically feasible.”

2026-01-30

2 min read